MultiFunction RF Electronics Unit & On-Board Processor (MFREU)

A complete SDR, processor and data storage unit built on Trident’s VPX modules suitable for a wide range of mission applications. Built with an EMI/EMC hardened chassis, integrated power supplies and flexible I/O, it is modular and customizable; the ideal solution for modern space applications.

Several Standard Configurations With Customization Available

Contact us at for more information.

Highly Integrated 

The MFREU combines Trident’s xDRT modules with support modules for a complete unit-level solution. Based on our powerful, flexible multifunction processing architecture, programmability over all key RF/Processing features is available in a very small size, weight, and power footprint. SpaceVPX compatibility and customization provides modularity, scalability and simplifies integration into space payloads.

Balanced Reliability 

TRL9 on several LEO missions (GEO launch Q3-2022), a proven Radiation Effects Mitigated architecture, coupled with radiation-tolerant components, redundancy and a robust mechanical design, provide a low C-SWaP, high reliability platform for operation in harsh orbital and interplanetary environments.

Multi-Function RF Unit

– Up to 8 TX & RX channels per card
– Up to 4 xDRTs per PSU
– 12-to-14-Bit DAC/ADC Options
– Interleaved Operation to >6 GSps
– DC – 6 GHz+ without RF Converter
– Internal/External RF Converter Options
– Card Synchronization
– Internal or External Ref/Sample CLK
– Up to 4 TB Storage per card
– Redundant or Single String
– Customization Available

On-Board Processor

– Up to 4 UDRTs (ZU19EG) per PSU
– Up to 12 SERDES per xDRT
– 1 & 10 GigE interfaces
– 50 Gbit PL DDR4 Read/Write
– Dynamic Reconfigurability
– Built-In-Test and HW Monitoring
– FW/SW Deployment Options
– Redundant or Single String
– Up to 4 TB Storage per card
– Customization Available

Typical Specifications

Module Compatibility: SQDRT (V5QV), UDRT (XQ-ZU19EG), RDRT (XQ-ZU28DR) and VDRT (VC1902)
RF Modalities: Synthetic Aperture Radar, Communications, Receiver/Processor, Arbitrary Transmitter
Card Positions: Scalable; 3 to 7 slots Typical; high-speed backplane inter-module connectivity
Size and Weight: 11″ x 12″ (baseplate) x 6″ Typical, < 13 kg
Power Supply: +28 VDC MIL-STD-704 and MIL-STD-461E Filtered, 300 W; primary and redundant
Power Consumption: Configuration Dependent; 50 W to 200 W+; flexible low-power/standby modes
Temperature: -20′ C to + 50′ C Operation (at baseplate)
Reliability: TID 25 krad minimum (TYP), No DSEL for LET <= 37 MeV-cm^2/mg


High speed data: SERDES, 1 GigE/10 GigE, Copper & Fiber
Control & low speed data: GigE/UDP, SpaceWire, CAN bus, Custom
General Purpose I/O: RS-422, LVDS, LVTTL, Custom
Discrete Enables: PSU Select/Enable, Module Select/Enable
RF: 50 ohm single ended, high-density
Reference & Sample Clocks: Internal or External
Synchronization: 1 PPS
Backplane Interface: SpaceVPX/OpenVPX per VITA 78/65
Power: Isolated, Filtered MIL-DTL 38999

Multifunction Reconfigurability

Multiple FPGA/Processor boot load options
Primary/Redundant NOR Flash
Dynamically Reconfigurable
On-orbit re-programmability