MultiFunction RF Electronics Unit & On-Board Processor (MFREU)

A complete SDR, processor and data storage unit built on Trident’s VPX modules suitable for a wide range of mission applications. Built with an EMI/EMC hardened chassis, integrated power supplies and flexible I/O, it is modular and customizable; the ideal solution for modern space applications.

Several Standard Configurations With Customization Available

Contact us at es-bd@tridsys.com for more information.

Highly Integrated 

The MFREU combines Trident’s xDRT modules with support modules for a complete unit-level solution. Based on our powerful, flexible multifunction processing architecture, programmability over all key RF/Processing features is available in a very small size, weight, and power footprint. SpaceVPX compatibility and customization provides modularity, scalability and simplifies integration into space payloads.

Balanced Reliability 

TRL9 on several LEO missions (GEO launch Q3-2022), a proven Radiation Effects Mitigated architecture, coupled with radiation-tolerant components, redundancy and a robust mechanical design, provide a low C-SWaP, high reliability platform for operation in harsh orbital and interplanetary environments.

Multi-Function RF Unit

– Up to 8 TX & RX channels per card
– Up to 4 xDRTs per PSU
– 12-to-14-Bit DAC/ADC Options
– Interleaved Operation to >6 GSps
– DC – 6 GHz+ without RF Converter
– Internal/External RF Converter Options
– Card Synchronization
– Internal or External Ref/Sample CLK
– Up to 4 TB Storage per card
– Redundant or Single String
– Customization Available

On-Board Processor

– Up to 4 UDRTs (ZU19EG) per PSU
– Up to 12 SERDES per xDRT
– 1 & 10 GigE interfaces
– 50 Gbit PL DDR4 Read/Write
– Dynamic Reconfigurability
– Built-In-Test and HW Monitoring
– FW/SW Deployment Options
– Redundant or Single String
– Up to 4 TB Storage per card
– Customization Available

Typical Specifications

Module Compatibility: SQDRT (V5QV), UDRT (XQ-ZU19EG), RDRT (XQ-ZU28DR) and VDRT (VC1902)
RF Modalities: Synthetic Aperture Radar, Communications, Receiver/Processor, Arbitrary Transmitter
Card Positions: Scalable; 3 to 7 slots Typical; high-speed backplane inter-module connectivity
Size and Weight: 11″ x 12″ (baseplate) x 6″ Typical, < 13 kg
Power Supply: +28 VDC MIL-STD-704 and MIL-STD-461E Filtered, 300 W; primary and redundant
Power Consumption: Configuration Dependent; 50 W to 200 W+; flexible low-power/standby modes
Temperature: -20′ C to + 50′ C Operation (at baseplate)
Reliability: TID 25 krad minimum (TYP), No DSEL for LET <= 37 MeV-cm^2/mg

Interfaces

High speed data: SERDES, 1 GigE/10 GigE, Copper & Fiber
Control & low speed data: GigE/UDP, SpaceWire, CAN bus, Custom
General Purpose I/O: RS-422, LVDS, LVTTL, Custom
Discrete Enables: PSU Select/Enable, Module Select/Enable
RF: 50 ohm single ended, high-density
Reference & Sample Clocks: Internal or External
Synchronization: 1 PPS
Backplane Interface: SpaceVPX/OpenVPX per VITA 78/65
Power: Isolated, Filtered MIL-DTL 38999

Multifunction Reconfigurability

Multiple FPGA/Processor boot load options
Primary/Redundant NOR Flash
Dynamically Reconfigurable
On-orbit re-programmability